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PCB printed circuit board

Surface treatment processes: lead-free hot air solder leveling, electrolytic nickel plating, electrolytic gold plating, electroless nickel plating, electroless gold plating, OSP

Maximum processing area: 580MM × 580MM;

Board thickness:

Thinnest: 0.6MM;

Thickest: 1.60MM Line width and line spacing:

Minimum line width: 0.125MM;

Minimum line spacing: 0.125MM; Pad and aperture:

Minimum pad: 0.6MM;

Minimum aperture: 0.3MM;

Forming methods: CNC routing, die stamping

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Detailed information

Information display, digital display, monitors and LED display screens for electronic instruments, equipment, household appliances, etc.

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